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Elogger ™ Strain Measurement System
Printed Wiring Board Strain Testing

Strain testing allows objective analysis of the strain and strain rate levels that a SMT package is subjected to during PWB assembly, test and operation.
The Elogger™ Strain Measurement System is special design for printed wiring board strain testing application, The real-time data provided by the Elogger system avoid the risk such failures include solder ball cracking, trace damage, pad lifting and substrate cracking during board manufacturing and test processes.

 

SYSTEM FEATURES & BENEFITS

• Portable Carrier, compact and lightweight.
• Connect to strain gauge and thermocouple directly
• Available for 120Ω or 350Ω quarter bridge inputs.
• High speed sampling rate up to 50K Hz per channel
• Simultaneous sampling with anti-aliasing filter and analog-to-digital conversion  for each channel.
• PC-Based mainframe provide Hi-Speed USB interface.
• Mainframe support various type modules.
• Meet hardware requirement of IPC/JEDEC 9704 & 9702.

Controller

model

apperance

slots

dimensions(LxHxW)

weight
(full installed)

EL-110

8

260 x 105 x 104 mm

3.5 kg

EL-210

4

163 x 105 x 102 mm

2.2 kg

EL-310

1

145 x 105 x 104 mm

0.8 kg

 

General

Operating Temperature

-40℃ - 70℃

Storage Temperature

-40℃ - 85℃

Maximum Altitude

5000m

Operating Relative Humidity

10% - 90%

interface

USB 2.0

Max Measuring unit

4

Power Requirement

Input Voltage Range

100 VAC-240 VAC

Shock and Vibration

Operational Shock

50g

Random Vibration

10 Hz – 500 Hz

Random Operating Frequency Range

5 g

 

Modules

Model

Measurement
type
Measurement
objects
Measuring Range
No.of Channel
Sampling Rate
(Pre Channel)
A/D Resolution

Accuracy

12QB8

Strain

120Ω strain gauge

±55,000μɛ

8 Ch

10,000 Hz

24 bit

±0.02%

35QB8

Strain

350Ω strain gauge

±55,000μɛ

8 Ch

10,000 Hz

24 bit

±0.02%

IEPAC4

IEPE

Accelerometer

±5V

4 Ch

50,000 Hz

24 bit

±0.05%

DCR4-IN
DCR3-OUT
(2 slot soccupy)

Resistance

Daisy-Chain

0~10Ω
0~100Ω
0~1000Ω

4 Ch

100,000 Hz

16 bit

±1.3%

TC4

Thermo

Thermocouple

8mV

4 Ch

3 Hz

24 bit

±0.1℃

TRI8

Digital I/O

TTL in & out

5V

8 Ch

10 Mega Hz

*

*

TDA50K4

Full-Bridge

Transducer

±25mV/V

4 Ch

50,000 Hz

24 bit

±0.02%

V01M4

Voltage

Voltage type

±10V

4 Ch

100,000 Hz

16 bit

±0.02%

FB4

Strain

120 & 350Ω
strain gauge

±55,000μɛ

4 Ch

50,000 Hz

24 bit

±0.02%

HSV05M4

Voltage

Voltage type

±10V

4 Ch

500,000 Hz

16 bit

±0.02%

 

SOFTWARE FEATURES

• User friendly software with One-touch report generation function
• Languages Version selectable includes English, Simplify and Traditional Chinese.
• Data analysis as diagonal strain, Max/Min principal strain, strain rate, Qstrain.
• Easy select analysis function and display in the same page.
• Allow to set up software on different computers.

 

 

SYSTEM CONFIGURATIONS

 

SGA Conditioners CONFIGURATIONS

PRODUCT SELECTION

Ultra High Speed Mainframe Input Modules

Model

Appearance

Measurement type

Measurement objects

Measuring Range

No.of Channel

Sampling Rate
(Pre Channel)
A/D
Resolution

Accuracy

HSV1M4

Voltage

SGA-11 and Voltage out type sensor

±10V

4 Ch

1,000,000 Hz

16bit

±0.02%

 

System Conditioners

Model

SGA

 

No.of Channel

12 slots

Size

264 x 164 x 83 mm

Weight (full installed)

3.6 Kg

Remarks

*SGA-11 Use only
*Output to HSV1M4

General

Operating Temperature

-40 °C - 70 °C

Storage Temperature

-40 °C - 85 °C

Maximum Altitude

5,000 m

Operating Relative Humidity

10 % - 90 %

interface

BNC by each channel

Output type

±5V

Max Measuring unit

4 units (48 channels)

Power Requirement

Input Voltage Range

100 VAC - 240 VAC

Shock and Vibration

Operational Shock

50 g

Random Vibration

10 Hz - 500 Hz

Random Operating Frequency Range

5 g

SMT assembly process

• Board depanelization (routing) processes
• All manual handling processes
• All rework and retouch processes
• Connector installation
• Component installation

 

Mechanical assembly

• Heat sink assembly
• Board support/stiffener assembly
• System board integration or system assembly

 

Shipping Environment

• Shock and vibration test
• Drop testing test

 

Board test processes

• In-Circuit Test (ICT)
• Board Functional Test or equivalent functional test

 

Automotive

Car control center

Tire pressure system

Parking sensors

 

Consumer Electronics

Smart phone and Pad

Laptop

Wearable devices

Sever