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Elogger ™ Strain Measurement System
Printed Wiring Board Strain Testing

Strain testing allows objective analysis of the strain and strain rate levels that a SMT package is subjected to during PWB assembly, test and operation.
The Elogger™ Strain Measurement System is special design for printed wiring board strain testing application, The real-time data provided by the Elogger system avoid the risk such failures include solder ball cracking, trace damage, pad lifting and substrate cracking during board manufacturing and test processes.

 

SYSTEM FEATURES & BENEFITS

• Portable Carrier, compact and lightweight.
• Connect to strain gauge and thermocouple directly
• Available for 120Ω or 350Ω quarter bridge inputs.
• High speed sampling rate up to 50K Hz per channel
• Simultaneous sampling with anti-aliasing filter and analog-to-digital conversion  for each channel.
• PC-Based mainframe provide Hi-Speed USB interface.
• Mainframe support various type modules.
• Meet hardware requirement of IPC/JEDEC 9704 & 9702.

EL-120         EL-220

Model

Slots

Dimensions(LxHxW)

Weight
(full installed)

EL-120

8

301.4 x 133.1 x 104 mm

3.5 kg

EL-220

4

208.6 x 133.1 x 104 mm

2.12 kg

 

General

Operating Temperature

-40℃ - 70℃

Storage Temperature

-40℃ - 85℃

Maximum Altitude

5000m

Operating Relative Humidity

10% - 90%

interface

USB 2.0

Max Measuring unit

4

Power Requirement

Input Voltage Range

100 VAC-240 VAC

Shock and Vibration

Operational Shock

50g

Random Vibration

10 Hz – 500 Hz

Random Operating Frequency Range

5 g

 

SOFTWARE FEATURES

• User friendly software with One-touch report generation function
• Languages Version selectable includes English, Simplify and Traditional Chinese.
• Data analysis as diagonal strain, Max/Min principal strain, strain rate, Qstrain.
• Easy select analysis function and display in the same page.
• Allow to set up software on different computers.

 

Modules

 

Model

Measurement
type

Measurement
objects

Measuring Range

No.of Channel

Sampling Rate
(Pre Channel)
A/D Resolution

Accuracy

QB-12

Strain

120Ω strain gauge

±55,000μɛ

8 Ch

10,000 Hz

24 bit

±0.02%

QB-35

Strain

350Ω strain gauge

±55,000μɛ

8 Ch

10,000 Hz

24 bit

±0.02%

IEP-1A

IEPE

Accelerometer

±5V

4 Ch

50,000 Hz

24 bit

±0.05%

TC-1A

Thermo

Thermocouple

8mV

4 Ch

3 Hz

24 bit

±0.1℃

QB-DU

Strain

120 & 350Ω
strain gauge

±55,000μɛ

4 Ch

50,000 Hz

24 bit

±0.02%

 

SMT assembly process

• Board depanelization (routing) processes
• All manual handling processes
• All rework and retouch processes
• Connector installation
• Component installation

 

Mechanical assembly

• Heat sink assembly
• Board support/stiffener assembly
• System board integration or system assembly

 

Shipping Environment

• Shock and vibration test
• Drop testing test

 

Board test processes

• In-Circuit Test (ICT)
• Board Functional Test or equivalent functional test

 

Automotive

Car control center

Tire pressure system

Parking sensors

 

Consumer Electronics

Smart phone and Pad

Laptop

Wearable devices

Sever